Objavljeni radovi:
[1]
1. Mladenović, I.O., Nikolić, N.D., Lamovec, J.S., Vasiljević-Radović, D.G., Radojević, V.J.: Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate, -Metals, MDPI, vol. 11, no. 1, pp. 111, 2021 (IF(2019)=2.117) (eISSN: 2075-4701), DOI: 10.3390/met11010111.
[2]
2. Mladenović I.O., Lamovec, J.S., Vasiljević-Radović, D.G., Vasilić, R., Radojević, V.J., Nikolić, N.D.: Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111) - Metals, MDPI, vol. 10, no. 4, pp.488, 2020 (IF(2019)=2.117) (eISSN: 2075-4701), DOI: 10.3390/met10040488.
[3]
1. Mladenović, I.O., Lamovec, J.S., Vasiljević-Radović, D.G., Radojević, V.J., Nikolić, N.D.: Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate, - International Journal of Electrochemical Science, ESG, vol. 15, no. 11, pp. 12173-12191, 2020, (IF(2019)=1.573) (ISSN: 1452-3981), DOI: 10.20964/2020.12.01.
[4]
2. Mladenović I.O., Lamovec J.S., Jović, V.B., Obradov, M.M., Vasiljević-Radović, D.G., Nikolić, N.D., Radojević, V.J.: Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance - Journal of the Serbian Chemical Society, vol. 84, no. 7, pp.729-741, 2019, (IF(2019)=1.097) (ISSN: 0352-5139), DOI: 10.2298/JSC181003023M.
[5]
3. Mladenović, I.O., Jakšić, Z.S., Obradov, М.M., Vuković, S.M., Isić, G., Tanasković, D.M., Lamovec, J.S.: Subwavelength nickel-copper multilayers as an alternative plasmonic material - Optical and Quantum Electronics, Springer, vol. 50, no. 5, pp.203, 2018, (IF(2019)=1.842) (ISNN: 0306-8919), DOI: 10.1007/s11082-018-1467-3.
[6]
1. Mladenović, I., Lamovec, J., Nikolić, N.D., Andrić, S., Obradov, M., Radojević, V., Vasiljević-Radović, D.: „Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings“, -Proceedings of the 7th Int.Conf. on Electrical, Electronics and Computing Engineering, IcEtran 2020, Društvo za Etran, Niš, Serbia, 2020., 28.-29. September, pp. 469-472, ISBN: 978-86-7466-852-8.
[7]
2. Mladenović, I., Đjorović-Amanović, J., Nikolić, N.D., Vasiljević-Radović, D., Radojević, V., Lamovec, J.: „Analysis and interpretation of the micromechanical properties of electrodeposited nickel coatings on different substrates“, -Proceedings of the 10th International scientific conference “Archibald Reiss days” 2020, University of criminal investigation and police studies, Belgrade, Serbia, 2020., 18.-19. November, vol. 10, no. 1, pp. 655-664, ISBN 978-86-7020-190-3.
[8]
3. Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Radulović, K., Vasiljević-Radović, D., Radojević, V.: „Artificial Neural Network for Composite hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters“,- Proceedings of the 31th International Conference on Microelectronics MIEL 2019, Niš, Serbia, 2019, 16.-18. September, pp. 133-136, ISBN: 978-1-7281-3418-5.
[9]
4. Mladenović, I., Jakšić, Z., Obradov, M., Vuković, S., Isić, G., Lamovec, J.: „Copper-nickel heterometallic multilayer composites for plasmonic applications“, -Proceedings of 4th Internacional Conference on Electrical, Electronics and Computing Engineering, IcEtran 2017, Kladovo, Serbia, 2017, 5.-8. Jun, pp. MOI3.1.1-MOI3.1.5., ISBN: 978-86-7466-692-0.
[10]
5. Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M., Radojević, V.: „Hardness response and adhesion of thin copper films on alloy substrates“, -Proceedings of the 4th Int.Conf. on Electrical, Electronics and Computing Engineering, ICEtran 2017, Kladovo, Serbia, 2017, 5.-8. Jun, pp. MOI1.3.1-MOI1.3.6, ISBN: 978-86-7466-692-0.
[11]
1. Mladenović, I., Jakšić, Z., Obradov, M., Vuković, S., Isić, G., Tanasković, D., Lamovec, J.: „Subwavelength nickel-copper multilayers as an alternative plasmonic material“, - Proceedings of the Abst.VI International School and Conference on Photonics PHOTONICA’17, Belgrade, Serbia, 2017, 28. Aug.-1. Sep., pp. 199-199, ISBN:978-86-82441-46-5.
[12]
2. Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Popović, B., Vorkapić, M., Radojević, V.: „Preperation and mechanical characterization of copper thin films with additives on alloy substrates“, -Proceedings of the Abst. Cost MP1402 Workshop, Institute of Chemistry, Technology and Metallurgy, Belgrade, Serbia, 2017, 29.-30. Aug, pp. 18-19, ISBN: 978-86-81405-22-2.
[13]
1. Mladenović, I., Lamovec, J., Jović, V., Radojević, V.: „Synergetic Effect of Additives on the hardness and adhesion of Thin Electrodeposited Copper Films“, - Serbian Journal of Electrical Engineering, Faculty of Technical Sciences Čačak, Serbia, vol. 14, no.1, pp. 1-11, 2017, ISSN: 1451-4869, DOI: 10.2298/SJEE1701001M.
[14]
1. Mladenović, I., Lamovec, J., Jović, V., Radojević, V.: „Sinergetski efekat aditiva u procesu elektodepozicije Cu na različitim supstratima i uticaj na mikromehanička svojstva sistema“, -Zbornik 60. Konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, ETRAN 2016, Društvo za Etran, Zlatibor, Srbija, 2016, 13.-16. jun, pp. MO1.1.1-MO1.1.6, ISBN: 978-86-7466-618-0.
[15]
2. Mladenović, I., Lamovec, J., Jović, V., Radojević, V.: „Uticaj structure višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava“ ,- Zbornik 59. Konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, ETRAN 2015, Društvo za Etran, Srebrno jezero, Srbija, 2015, 8.-10. jun, pp. MO2.1.1-4, ISBN: 978-86-80509-71-6.
[16]
3. Mladenović, I., Lamovec, J., Jović, V., Radojević, V.: „Uticaj aditiva tiouree na kompozitnu i apsolutnu tvrdoću elektrodeponovanih filmova bakra“, -Zbornik 57. Konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, ETRAN 2013, Društvo za Etran, Zlatibor, Srbija, 2013, 3.-6. jun, pp. MO3.2, ISBN: 978-86-80509-68-6.
